The annual meeting of TC201 is held each year on the cycle - Europe, North America, Asia. Peter Sherwood as Head of the US Delegation is responsible for organizing the 2026 North America meeting

The meeting as well as lodging place will be Four Points Hotel by Sheraton, Kelowna, British Columbia, Canada.

The AVS International Symposium and Exhibition has been developed to address cutting-edge issues associated with vacuum science and technology in both the research and manufacturing communities. The Symposium is a week long forum for science and technology exchange featuring papers from technical divisions and technology groups, and topical conferences on emerging technologies. The equipment exhibition is one of the largest in the world and provides an excellent opportunity to view the latest products and services offered by over 200 participating companies. More than 3,000 scientists and engineers gather from around the world to attend. Short courses are offered in conjunction with the International Symposium providing specialized training in specific areas of vacuum science and related technologies. A Career Workshop and Job Center are also offered to all attendees. The Workshop covers such topics as résumé preparation, job search skills, networking, interviewing skills, and more. The Job Center provides the opportunity for job seekers to submit their résumés and meet with potential employers.

In conjunction with the AVS 72nd International Symposium & Exhibition.

Course Objectives

• Understand vacuum fundamentals essential to operating, maintaining, designing, or using vacuum systems.

• Know the working principles and limitations of pumps, gauges, and other vacuum system components.

• Understand the procedures for operating and performing preventive maintenance on vacuum systems, including analyzing and troubleshooting malfunctioning vacuum systems and leak detection.

• Learn the design concepts involved in matching equipment and instrumentation to applications.

WINDS is an international workshop designed to explore the fundamental properties of nanoscale heterostructures and potential device applications. The workshop is composed of morning and evening sessions, with afternoons free for ad hoc meetings to encourage extended interaction and discussion. WINDS provides a forum for material, device, and characterization as well as experimental and modeling researchers to interact. This breadth of expertise reflects the technical challenges in developing nanoscale devices and material systems, since every device is a heterostructure of one form or another and the properties of the interfaces often determine the functionality and properties of the nanoscale system.

As semiconductor devices continue to scale for artificial intelligence and high-performance computing applications, molybdenum is gaining attention as a next-generation material for advanced thin film processes. Its strong conductivity and low resistivity make it a compelling candidate for highly integrated structures where performance, power efficiency, and process reliability are increasingly critical.

This e-Talk will provide an educational overview of molybdenum in semiconductor thin film deposition, including key material properties, process considerations, and the practical challenges associated with stable handling and delivery. The discussion will also address why advanced delivery approaches are important when working with solid source precursors that require careful moisture control and stable process operation.

Participants will gain a technical understanding of how molybdenum can support next-generation semiconductor process requirements, and what factors should be considered when evaluating materials and delivery strategies for advanced deposition environments.

The workshop focuses on Atomic Layer Deposition (ALD) and its role in advancing materials-to-manufacturing (M2M) technologies, bringing together leading researchers, scientists, industry professionals, and students from academia, national laboratories, and industry. The workshop will feature expert lectures and discussions on:

• Advanced ALD processes and next-generation deposition technologies

• Thin-film growth mechanisms, surface chemistry, and interface engineering

• Semiconductor device fabrication and integration

• 2D materials, nanotechnology, and emerging device architectures

• AI/ML-driven materials discovery and process optimization.

The annual PCSI conference is devoted to achieving a fundamental understanding of the physical, chemical, biological, structural, optical, magnetic, and electrical properties of surfaces and interfaces. These studies include novel growth processes and interfacial phenomena, new characterization tools, transport, and functionality of the structures for future devices. Generous amounts of discussion time will be included in the program in order to emphasize the workshop character and to stimulate the exchange of new ideas.

Virtual Meeting

The 1st American Workshop on Ellipsometry (AWE-1) will be the inaugural Topical Conference & Exhibition of the AVS Spectroscopic Ellipsometry (EL) Technical Group, co-organized in collaboration with the North American Ellipsometry Association (NAEA). AWE-1 is especially dedicated to the participation of undergraduate and graduate students, providing ample opportunities for scientific and technical discussions and professional networking, to help them become the next generation of talented ellipsometry users and innovators. Accordingly, AWE-1 is a workforce development initiative that aims to provide a pipeline of young talent for EL sessions at the annual AVS Symposia & Exhibitions.

Atomic layer etching (ALE) has attracted considerable attention as an alternative to conventional reactive ion etching due to its potential for reduced ion-induced damage under controlled conditions, improved selectivity, and minimized pattern loading effects. However, the industrial adoption of ALE has been slow. In this work, we analyze the key barriers limiting widespread implementation from an industrial perspective, including low etch throughput, imperfect self-limiting behavior, particle generation, and process complexity. Despite these challenges, we demonstrate that ALE enables vertical profile formation in low-k dielectric etching under reduced ion energy, increasing Cu volume by up to ∼67%. Because conventional O2-based activation induces chemical damage, mitigating capacitance degradation requires optimized material conditions and underscores the need for O2-free chemistries. Finally, we propose transitioning from conventional multistep ALE cycles to simplified “one ALE cycle per one plasma pulse” schemes to simultaneously address throughput, particle, and stability issues, which are critical to the industry perspective.

The ASD Workshop was initiated in 2016 to provide a scientific communication channel to learn and exchange about selective deposition techniques. It has since offered a forum for open discussions between researchers from academia and industry. The meeting will include half day Tutorials (starts Sunday afternoon 1:00 p.m.) followed by the Workshop (two full days, Monday and Tuesday). The last day of the Workshop (ends Wednesday around 2:00 p.m.) will highlight the state of the art of ASD developments in High Volumen Manufacturing with invited presentation from our main industrial partners.

Atomic layer etching (ALE) has attracted considerable attention as an alternative to conventional reactive ion etching due to its potential for reduced ion-induced damage under controlled conditions, improved selectivity, and minimized pattern loading effects. However, the industrial adoption of ALE has been slow. In this work, we analyze the key barriers limiting widespread implementation from an industrial perspective, including low etch throughput, imperfect self-limiting behavior, particle generation, and process complexity. Despite these challenges, we demonstrate that ALE enables vertical profile formation in low-k dielectric etching under reduced ion energy, increasing Cu volume by up to ∼67%. Because conventional O2-based activation induces chemical damage, mitigating capacitance degradation requires optimized material conditions and underscores the need for O2-free chemistries. Finally, we propose transitioning from conventional multistep ALE cycles to simplified “one ALE cycle per one plasma pulse” schemes to simultaneously address throughput, particle, and stability issues, which are critical to the industry perspective.

The ICMCTF is internationally recognized as a vibrant technical conference that integrates fundamental and applied research focused on thin film deposition, characterization, and advanced surface modification techniques.  ICMCTF is the premier international meeting in the field promoting global exchange of information among scientists, technologists, and manufacturers.  The conference draws more than 800 attendees each year with multiple oral technical sessions and a well attended poster session which is a major component of the technical program.

In conjunction with ICMCTF 2027.

TACT 2027 will cover a broad spectrum of topics related to thin-film, coating, and plasma technologies, with applications spanning sustainable energy, semiconductors, optoelectronics, flexible devices, and protective, tribological, organic, biological, and other functional coatings. The conference will feature seven specialized symposia and one short course. In addition, special issues associated with the conference will be organized in collaboration with the peer-reviewed high-impact journals “Vacuum” and “Surface and Coatings Technology”.

The AVS 27th International Conference on Atomic Layer Deposition (ALD 2027) featuring the 14th International Atomic Layer Etching Workshop (ALE 2027) will be a three-day meeting dedicated to the science and technology of atomic layer controlled deposition of thin films and now topics related to atomic layer etching.  Since 2001, the ALD conference has been held alternately in the United States, Europe and Asia, allowing fruitful exchange of ideas, know-how and practices between scientists. This year, the ALD conference will again incorporate the Atomic Layer Etching 2027 Workshop (ALE 2027), so that attendees can interact freely. The conference will take place Sunday, June 20 - Wednesday, June 23, 2027, in Dresden, Germany.

As in past conferences, the meeting will be preceded by one day of tutorials and a welcome reception. Sessions will take place (Monday-Wednesday) along with an industry tradeshow. All presentations will be audio-recorded and provided to attendees following the conference (posters will be included as PDFs). Anticipated attendance is 800+.

Virtual Meeting

The 40th North American Conference on Molecular Beam Epitaxy (NAMBE 2027) is a prominent international forum for reporting scientific and technological developments in Molecular Beam Epitaxy research. It will take place August 2-5, 2027, at the Renaissance Asheville Downtown Hotel, Asheville, NC.

The conference showcases important results from fundamental materials and device research, through technological applications, and into high-volume and low-cost production. NAMBE features the presentations of the Art Gossard MBE Innovator Award, the NAMBE Young Investigator Award, the Best Student Paper awards, and the Jim Harris MBE Scientific Discovery Award.

In addition to a diverse technical program, vendors will exhibit the latest equipment available for material growth and characterization. The exhibit will surround the coffee breaks and poster presentations, providing many opportunities for discussions between attendees and vendors. There will also be a job board.

During the weekend preceding the conference, we offer an exclusive workshop titled “Epitaxy in the Age of AI” which will be held July 31-August 1, 2027. The Workshop will host invited speakers across the range of materials systems and will focus on how AI approaches can impact their growth by MBE. There will be an additional poster session which is accepting abstracts through June 30, 2027.

The AVS International Symposium and Exhibition has been developed to address cutting-edge issues associated with vacuum science and technology in both the research and manufacturing communities. The Symposium is a week long forum for science and technology exchange featuring papers from technical divisions and technology groups, and topical conferences on emerging technologies. The equipment exhibition is one of the largest in the world and provides an excellent opportunity to view the latest products and services offered by over 200 participating companies. More than 3,000 scientists and engineers gather from around the world to attend. Short courses are offered in conjunction with the International Symposium providing specialized training in specific areas of vacuum science and related technologies. A Career Workshop and Job Center are also offered to all attendees. The Workshop covers such topics as résumé preparation, job search skills, networking, interviewing skills, and more. The Job Center provides the opportunity for job seekers to submit their résumés and meet with potential employers.

In conjunction with the AVS 73rd International Symposium & Exhibition.

The FCMN will bring together scientists and engineers interested in all aspects of the characterization technology needed for nanoelectronic materials and device research, development, integration, and manufacturing. All approaches are welcome: chemical, physical, electrical, magnetic, optical, in situ, and real-time control and monitoring. The semiconductor industry is evolving rapidly: the conference will highlight major issues and provide critical reviews of important materials and structure characterization and nearline/inline metrology methods, including hardware, data analysis, and AI and machine learning, as the industry both extends the technology deep into the nanoscale and increases the diversity of devices and systems.

Largest gathering of International SIMS experts in the field. Conference rotates between Asia, North America and Europe every 2 years. SIMS 2022 in Minneapolis was sponsored by AVS. We'd like to continue the strong association of SIMS with AVS. Event is typically Sunday to Friday, with Tutorials on Sunday, talks Mon-Fri, with a banquet event as well. Exhibit for vendors is an important component as well. Presentation of our bid must be made at the SIMS 2024 conference in early Sept 2024.