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UID:ef877728-216e-4937-b490-76d60d4e33ba@avs.org
DTSTAMP:20260429T184038Z
DTSTART:20240702T110000Z
DTEND:20240705T230000Z
LOCATION: Kyoto Research Park, Kyoto, Japan
DESCRIPTION:The International Symposium on Sputtering and Plasma Processes (ISSP) was established in 1991. The main subject of the 1st symposium was "Reactive Sputtering". It was the time that some new approaches to improve deposition rate and stability of the reactive sputtering process were started to be addressed. Since then, the symposium has been held biennially. At each symposium, the current topics and trends concerning sputtering and plasma processes have become the main focus and such topics have been discussed intensively.\n\nAbstract Deadline: January 19, 2024\n\n Kyoto Research Park, Kyoto, Japan\n\n Tetsuhide Shimizu; e-mail: simizu-tetuhide@tmu.ac.jp and Junichi Nomoto; e-mail: nomoto.junichi@aist.go.jp
SUMMARY: International Symposium on Sputtering & Plasma Processes (ISSP 2024)
PRIORITY:3
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DESCRIPTION:Reminder
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