- Learn various microfabrication technology for MEMS.
- Understand unique requirements for MEMS fabrication.
- Learn process design and control.
- Learn about merging mechanical devices with circuits.
- Learn current trends and future technology direction for MEMS.
In micro-electromechanical systems (MEMS), both electrical and mechanical devices are formed. Often, the mechanical devices consist of movable components that are partially separated from the substrate they are anchored to. In some cases, special films with unique properties for sensing or mechanical movement are needed. Although the basic principles of the IC technologies used in Si can be applied, there are many unique requirements for MEMS fabrication. In this short course, various microfabrication technology for MEMS will be introduced. Process design and factors for precise dimension control for MEMS will be covered. Issues related to integrating mechanical and electrical components will be discussed. Current technology trends for MEMS with examples in mechanical, optical, and chemical sensing and actuation will be given. New development of MEMS technology in the future will be addressed. The specific topics covered are:
- Patterning by optical, x-ray, and focused ion beam lithography.
- Selective wet etching processes.
- Directional dry etching processes.
- Thin-film deposition by evaporation, sputtering, electroplating, chemical vapor deposition, and laser assisted deposition.
- Bonding and release of mechanical structures.
- MEMS technology for mechanical, optical, and chemical sensors.
- Future trends and development in MEMS technology.
Course Cost: $790
Who should attend?
Engineers, scientists, technologists, and technical managers with an interest in the development and implementation of microfabrication technology for microelectromechanical systems.
Professor, Department of Electrical Engineering and Computer Science, University of Michigan