Course Objectives

• Learn about different ion sources available for FIB instruments
• Understand ion-solid interactions and how to optimize milling methods while minimizing ion implantation damage
• Learn about ion patterning and understanding redeposition
• Learn about 2D sectioning and 3D FIB SEM tomography
• Methods for S/TEM and APT specimen preparation
• Introduction to cryo-FIB methods for physical and biological sciences 

Course Description

In this course we will introduce different FIB source technologies and discuss application advantages and disadvantages for each. The basics of ion-solid interaction theory will be discussed, including use of ions for different applications and understanding differences between redeposition artifacts and inherent ion implantation damage. The expanding applications of plasma FIB instruments compared to traditional Ga⁺ ion FIBs will be emphasized.  Ion patterning, deposition, enhance etching, and delayering of semiconductor devices will be presented. The use of FIBs for nano- and micro- prototyping, including applications for mechanical testing will be presented.  Large area 2D sectioning and 3D FIB-SEM tomography will be covered. FIB methods for S/TEM and APT specimen preparation will be discussed in detail with an emphasis on mitigating ion implantation damage. Finally, we will discuss cryo-FIB methods for 2D, 3D, and S/TEM specimen preparation.

Course Materials

• Online Course/Program includes link to PDF notes file

• In Person Course/Program includes printed notes

Who Should Attend?

This course is directed towards students, scientists, engineers and technicians who use or want to learn more about FIB instruments.