Course Objectives

• Appreciate the benefits of ionization and the use of plasmas in deposition processes in terms of film microstructure and properties
• Understand the operation of magnetrons in conventional and HiPIMS mode
• Learn about the effects of various HiPIMS parameters, including reactive HiPIMS 

Course Description

Expectations increase to precisely control properties of thin films and thick coatings. This short course will focus on how these expectations can be met by using ionization in sputter deposition processes, and specifically, high-power impulse magnetron sputtering.  The evolution of this technology, now over two decades under development, can be derived from related, plasma-based techniques.  The technology and underlying physics will be explained in a systematic, easy-to-understand approach, starting with ordinary magnetron sputtering and basic plasma and sheath properties, and progressing to more complex situations, including reactive HiPIMS and various modern modes with controlled polarity reversal and pulse patterns.  

The specific topics covered are:

• Effects of Ions on Film Growth: A Motivational Introduction
• Sputtering and Magnetron Sputtering
• Early Attempts to Add Ionization to Deposition Processes
• Introduction of Hipims, Definition, and Technical Means
• Reactive Hipims
• Examples: Nitrides, Oxides, Complex Films, Multilayers, Diamond-Like Carbon
• Arcing and Arc Mitigation
• Deposition rate concerns 
• Bipolar and “Hybrid” Deposition Technologies

Course Materials

Course Notes and a copy of the tutorial paper “Reactive HiPIMS”