- Understand the nature of surfaces (practical and technologically significant).
- Learn about surface preparation, sample handling, and contamination control.
- Develop insight into surface characterization and analysis.
- Learn about surface preparation and film nucleation during thin-film deposition.
Substrate preparation is an integral part of any film deposition process. This includes removing unwanted impurities and residues as well as conditioning the surface to promote adhesion through activation, or interfacial layers. The selection of the cleaning and surface preparation techniques is dependent on the nature of the surface and the deposition technique.
This course reviews surface cleaning and preparation techniques, condensation and nucleation of the deposited atoms, film-substrate interface formation, and the initial stages of film growth. Both wet and dry cleaning procedures will be discussed with an aim towards remove of ionic, metallic and organic residues as well as particles. Emphasis will be placed on atomistic and reactive deposition utilizing evaporation, sputtering, chemical vapor and molecular beam deposition. Film properties, such as intrinsic stress, which may affect adhesion will be reviewed. Techniques used to characterize the elemental composition, chemical state, and phase of material will be illustrated for both in situ and ex situ analysis.
Course Cost: $790
Who should attend?
Scientists, engineers, technicians, supervisors, and others who are involved in the deposition of materials in vacuum or controlled ambients, and who want to learn about the effects of surface preparation and condition on the nucleation and growth of films and the subsequent interfacial adhesion and film properties. Knowledge of elemental physics and chemistry is helpful in assimilating the course material, but it is not essential.
President of the International Technology Center