- Understand the fundamentals of sputter deposition
- Review and discuss options for sputtering system design
- Learn how rf sputtering differs from dc sputtering and understand how rf sputtering works
- Understand reactive sputtering
- Understand thin film properties are modified by adjusting sputtering parameters
Films are deposited by sputtering for their useful properties in microelectronics, surface protection, optics, etc., by a variety of sputtering techniques. The film properties depend on the parameters of the sputtering system, such as pressure and substrate bias.
This course provides an understanding of the cause and effect of changes in sputtering parameters on the energetics of the sputtering and deposition processes and their relationship to film properties. The energy and distribution of species ejected from the target are discussed. The effect of the sputtering system on material transport to the substrate and subsequent film deposition is also discussed for films of metals, alloys, and compounds. The parameters of different sputtering systems (diode, triode, magnetron, and ion guns) with DC and RF power supplies are discussed with respect to film properties.
$350 – AVS Platinum Member
$400 – AVS Gold/Silver Member
$400 – Non-Member
$200 – Full Time Student
Course Cost: $790
Who should attend?
Scientists, technicians, and others involved in the deposition of thin films by sputtering who want to understand the effects of operating parameters on the properties of metal, alloy, and dielectric films.
Head for Department of Metallurgical and Materials Engineering, Colorado School of Mines