Course Objectives
- Learn why, where and how PECVD is used in industrial applications ranging from solar photovoltaics and semiconductors to hard coatings.
- Understand how the process variables affect the properties of materials and device performance.
- Learn and understand the basics of plasma equipment design and operation.
- Get a broad overview of current manufacturing equipment and fabrication processes.
Course Description
This course starts with a brief review of the basics of processing plasmas. This knowledge is then applied to the plasma deposition of thin films in practical device applications. The unique aspects of PECVD are emphasized by an in-depth comparison of PECVD with other deposition technologies. The relationship between process parameters and film properties is illustrated by reviewing several important device applications of PECVD.
The deposition and properties of important materials such as silicon oxide, silicon nitride, silicon carbide, amorphous and polycrystalline silicon, diamond and diamond-like carbon are discussed in detail.
Much emphasis is placed on an up-to-date discussion of hardware and hardware considerations as these apply to process control and process safety.
Important trends in the design and operation of commercial equipment, particularly as it relates to microelectronics, are discussed in detail.
Online Costs:
$350 – AVS Platinum Member
$400 – Non-Member
$200 – Full Time Student
Course Materials
Course Notes
Course Cost: $790
Who should attend?
Those who want to get a good understanding of plasma-based deposition techniques, materials, and devices both in commercial and laboratory applications.
Instructors
Robert Grubbs
Scientific Director of Thin Films, IMEC