- Learn the fundamentals of ALD based on sequential self-limiting surface reactions.
- Understand the important advantages of ALD and comparison with CVD.
- Learn about ideal and non-ideal ALD and thermal and plasma-enhanced ALD.
- Understand how ALD surface chemistry and growth are studied using in situ probes.
- Learn how ALD can be utilized for thin film nanoengineering.
- Understand the many current and potential applications of ALD.
This course develops an understanding of atomic layer deposition (ALD). Al2O3 ALD is first introduced as an ideal model system and then ALD is compared with CVD. Non-ideal ALD behavior is presented before discussing plasma and radical-enhanced ALD. Subsequently, novel surface chemistry is described for metal ALD.
The course reviews the important topic of nucleation and growth during ALD before introducing low temperature ALD. ALD on polymers and ALD on particles are then discussed to illustrate some potential new application areas for ALD. ALD on porous substrates is reviewed to illustrate how ALD can deposit conformally on high aspect ratio structures. The ALD of nanolaminates and composites is then discussed to demonstrate the potential of ALD for thin film nanoengineering.
$350 – AVS Platinum Member
$400 – AVS Gold/Silver Member
$400 – Non-Member
$200 – Full Time Student
Course Cost: $690.00
Who should attend?
Engineers and scientists who want an introduction to ALD or need to broaden or update their knowledge of this important field.
Dept. of Chemistry & Biochemistry, University of Colorado at Boulder