- Learn about the materials science, fundamental principles and engineering technology necessary to effectively utilize copper (Cu) interconnects.
- Get to know the state-of-the-art equipment and process schemes necessary to produce advance Cu metallization in manufacturing.
- Find out the merits and challenges of various characterization techniques for process control and quality assurance.
- Understand the material properties, interactions and processing challenges associated with the integration of Cu interconnects.
- Know the advantages and limitations of current Cu interconnect strategies.
This course covers the materials science, fundamental principles, and engineering technology necessary to effectively use Cu as a conductor for integrated circuits. Emphasis will be on the material properties, interactions, and processing challenges associated with the integration of Cu interconnects.
The equipment and associated process schemes available to produce Cu metallization will be presented. Also, the merits and challenges of various characterization techniques for process control and quality assurance will be discussed. And, finally, the advantages and limitations of current Cu interconnect strategies will be analyzed.
Course Cost: $790
Who should attend?
This course is intended for engineers, scientists, managers, and technicians who are or will be involved with or impacted by the implementation of Cu technology. The course will provide the basics for those unfamiliar with materials science and interconnect technology as well as the most recent advances in Cu metallization to keep practitioners on the leading edge. Discussion time will be included in the program.
Consultant, Innovative Materials Group, Inc.