TEL Technology Center America LLC
E-mail: angelique_raley @ avs.org

ANGÉLIQUE RALEY is currently the Plasma etch BU Director for Tokyo Electron America (TEL). Prior to this she worked as a plasma etch process development engineer and later led a plasma process development team. Her work focused on multi-patterning, EUV patterning and back end of line dielectric/conductor etch for advanced logic nodes.   She received her B.S./M.S. (materials science) from Polytech Grenoble school of engineering in France and completed her final year at UC Berkeley. She started her career in the semiconductor industry in integration at Samsung before joining TEL in 2010.

Angélique has been an active member of the semiconductor research community and has contributed through multiple conference papers, invited talks and over 40 granted patents to the steadfast advancement of key plasma etch technologies.  More recently, she has been driving industry/ faculty collaboration with SUNYPOLY NY University to create a plasma center of excellence and equip the site with the necessary equipment to train the next generation of plasma scientists. She is also actively engaged in SRC, serves as a member on the SPIE Lithography etch and integration committee, the AVS ALD/ALE conference ALE technical program committee and as the current AVS PSTD division secretary.