IBM Quantum
E-mail: sebastian_engelmann @ avs.org

SEBASTIAN U. ENGELMANN is currently the System Component lead at IBM Quantum in Yorktown Heights, NY. He received his Vordiplom in Physics from the University of Würzburg, Germany in 2003 and his Ph.D. in Materials Science and Engineering from the University of Maryland, College Park in 2008. In 2008, he joined the Advanced Plasma Processing Group at IBM. He was promoted to Manager of the Advanced Plasma Processing Group in 2015. In 2021 he joined IBM Quantum as the system components lead.  

He has published over 100 peer-reviewed papers and holds over 30 patents and has had numerous invited talks at international conferences. His main research activities were improving the fundamental understanding of plasma-polymer interactions with main focus on 193nm PR resist materials interactions. After that his Research activities grew into developing plasma processes that enable the integration of Trigate and Nanowire device geometries, novel materials (SiGe, III-V etc.) or completely new technology approaches (Photonics, MRAM, packaging etc.) As manager of the plasma processing group, he was looking at pioneering new uses of plasma etch technology in conventional and novel applications. As Quantum component lead, he is seeking to drive hardware component development for current and future quantum computing systems and is leading global efforts on developing supply chain and hardware ecosystems in this space.

He has served on the organizing committee of the SPIE advanced nanopatterning conference since its inception in 2012, including two years as the conference chair (2017/18). Since 2019 he serves as member-at-large to the PSTD committee at AVS, serving as PSTD chair in 2022. Since then, he was chairing the Quantum focus topic at the AVS symposium. He has been active in AVS for over 15 years, first as a student, then as a regular member.