Short Courses

AVS short courses provide training for technicians, scientists, and engineers in three broad categories: Vacuum and Equipment Technology; Materials and Interface Characterization; and Materials Processing.

The AVS National Short Course Program will take place in conjunction with the AVS 66th International Symposium & Exhibition at the Greater Columbus Convention Center in Columbus, Ohio, October 21-24, 2019.


Atomic Layer Etching (New Course!)

Course Objectives
  • Learn the fundamentals of ALE based on sequential self-limiting reactions.
  • Understand the differences between plasma ALE and thermal ALE.
  • Learn about the surface chemistry and reactors for ALE.
  • Understand why plasma ALE can obtain atomic layer precise anisotropic etching.
  • Learn how thermal ALE can achieve atomic layer precise isotropic etching.
  • Learn how ALE can be utilized for thin film nanoengineering and device fabrication.
  • Understand the many current and potential applications of ALE.

Instructor: Steve George Dept. of Chemistry & Biochemistry and Dept. of Mechanical Engineering, University of Colorado at Boulder 
Dates:  October 23, 2019 (W)

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Essentials of Accurate and Reliable Surface Analysis using X-ray Photoelectron Spectroscopy (XPS) and Auger Electron Spectroscopy (AES)

Course Objectives

  • Learn essential principles of two major surface analytical methods – XPS and AES
  • Learn capabilities and limitations of techniques
  • Become familiar with the many applications of XPS and AES for material analysis, product testing, and quality control
  • Learn accurate and reliable practices of quantitative surface analysis

Instructor: Kateryna Artyushkova Senior Staff Scientist at Physical Electronics 
Date:  October 23, 2019 (W)

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Fundamentals of Vacuum Technology

Course Objectives
  • Understand vacuum fundamentals essential to operating, maintaining, designing, or using vacuum systems
  • Know the working principles and limitations of pumps, gauges, and other vacuum system components
  • Understand the procedures for operating and performing preventive maintenance on vacuum systems, including analyzing and troubleshooting malfunctioning vacuum systems and leak detection
  • Learn the design concepts involved in matching equipment and instrumentation to applications 

Instructors:

Date:  October 21- 24, 2019 (M-Th)

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Plasma Etching and RIE: The Fundamentals

Course Objectives:

The Fundamentals

  • Know the basic concepts of plasma etching.
  • Understand the physics of RF glow discharges (both high and low density).
  • Understand the surface science aspects of reactive ion etching (RIE).
  • Learn about plasma-surface chemistry leading to etching.
  • Recognize the factors that influence etching anisotropy.

Instructor: Randy Shul, Technical Staff, Sandia National Laboratories  
Date:  October 21, 2019 (M)

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Plasma Etching and RIE: Fundamentals and Applications

Course Objectives

The Fundamentals:

  • Know the basic concepts of plasma etching.
  • Understand the physics of RF glow discharges (both high and low density).
  • Understand the surface science aspects of reactive ion etching (RIE).
  • Learn about plasma-surface chemistry leading to etching.
  • Recognize the factors that influence etching anisotropy.

Applied Aspects:

  • Know fluorocarbon plasma etching of Si and its compounds.
  • Learn about etching of Al, organics, III-V compounds, etc.
  • Understand selectivity, loading effects, ARDE, uniformity, damage, feature charging, particles, wall reactions, etc.
  • Become familiar with plasma diagnostics. 

Instructor: Randy Shul, Technical Staff, Sandia National Laboratories  
Date:  October 21-22, 2019 (M-T)

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Reactive Sputtering and Deposition

Course Objectives
  • Understand reactive processes for doping films.
  • Learn about deposition methods and applications.
  • Know the methods for sputtering insulators: AC, RF, Pulsed DC, ion beams, etc.
  • Understand process monitoring and control methods as well as process modeling.

Instructor: Joe Greene, Professor of Materials Science and Head of Electronics Materials Division, University of Illinois
Date:  October 22, 2019 (T)

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Sputter Deposition

Course Objectives

  • Understand target effects and sputtered atoms
  • Learn about magnetron, diode, triode, and ion beam systems
  • Learn about DC and RF systems for targets and substrates
  • Understand reactive sputtering
  • Understand film properties and learn system parameters 

Instructor: Joe Greene, Professor of Materials Science and Head of Electronics Materials Division, University of Illinois
Date:  October 21, 2019 (T)

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UHV Design and Practices

Course Objectives
  • Understand the pump factors that limit ultimate pressure.
  • Know the degassing methods that minimize the total outgassing rate.
  • Learn how to measure total and partial pressures in UHV.
  • Learn the operating methods necessary to maintain UHV.

Instructor: Michael Bagge-Hansen staff scientist, Lawrence Livermore National Lab, Livermore, California 
Date: October 24, 2019 (Th) 

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Vacuum and Cryogen Safety

Course Objectives
  • Discuss common hazards associated with vacuum systems, their associated pressure systems, and a variety of associated hazards such as brittle material concerns, electrical safety issues, etc.
  • Identify the potential for accidental overpressure of the vacuum system and discuss the concerns associated with pressurized sources of process and backfill gases typical of vacuum applications. 
  • Learn about the limitations and safety concerns associated with vacuum purging of associated pressure systems. 
  • Discuss the hazards of cryogenic fluids and cryogenic fluid handling components commonly associated with vacuum applications.
  • Propose a variety of hazard mitigation techniques and good practices applicable to the above hazards.
  • Share common accident scenarios and lessons learned related to the fields of vacuum and associated pressure components and cryogenic fluids. 

Instructor: Roger Shrouf Consultant/Retired Technical Staff at Sandia National Laboratories (SNL) 
Date: October 24, 2019 (Th) 

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  • Learn the fundamentals of ALE based on sequential self-limiting reactions.
  • Understand the differences between plasma ALE and thermal ALE.
  • Learn about the surface chemistry and reactors for ALE.
  • Understand why plasma ALE can obtain atomic layer precise anisotropic etching.
  • Learn how thermal ALE can achieve atomic layer precise isotropic etching.
  • Learn how ALE can be utilized for thin film nanoengineering and device fabrication.
  • Understand the many current and potential applications of ALE.



 


*Courses are subject to cancellation