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UID:31891343-ec03-43a0-bd43-b6d2ffecbe8e@avs.org
DTSTAMP:20261023T033351Z
DTSTART:20261208T180000Z
DTEND:20261208T190000Z
LOCATION: Virtual/Online
DESCRIPTION:As semiconductor devices continue to scale for artificial intelligence and high-performance computing applications, molybdenum is gaining attention as a next-generation material for advanced thin film processes. Its strong conductivity and low resistivity make it a compelling candidate for highly integrated structures where performance, power efficiency, and process reliability are increasingly critical.This e-Talk will provide an educational overview of molybdenum in semiconductor thin film deposition, including key material properties, process considerations, and the practical challenges associated with stable handling and delivery. The discussion will also address why advanced delivery approaches are important when working with solid source precursors that require careful moisture control and stable process operation.Participants will gain a technical understanding of how molybdenum can support next-generation semiconductor process requirements, and what factors should be considered when evaluating materials and delivery strategies for advanced deposition environments.\n\nREGISTER NOW!\n\n Virtual/Online\n\n Heather Korff
SUMMARY: AVS e-Talk: Molybdenum for Next-Generation Thin Film Deposition: Material Properties, Process Considerations, and Delivery Challenges
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