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UID:04c14e71-d71d-4b2c-a09b-72cc358bcbcf@avs.org
DTSTAMP:20260314T230001Z
DTSTART:20230215T180000Z
DTEND:20230215T220000Z
LOCATION: Virtual/Online
DESCRIPTION:\nAtomic Layer Deposition (ALD) has become a key technology in both the lab and the fab with many devices and other applications benefiting from the (ultra)thin films that can be prepared with very precise thickness control and with unparalleled conformality and uniformity. Nowadays, a significant number of the ALD processes employed are so-called plasma-assisted or plasma-enhanced ALD processes. \n\nThe reasons why and when to use plasma-assisted ALD are often not clear as well what kind of plasma configurations to use and which conditions to apply. This webinar will address these aspects starting with the basics of ALD and plasma-based processing and will range up to the applications that can benefit from plasma-assisted ALD\n\n Virtual/Online\n\n Heather Korff
SUMMARY: AVS Webinar: Plasma-Assisted Atomic Layer Deposition:  Basics, Equipment, Applications
PRIORITY:3
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