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UID:e4ecd1eb-c7dc-41fb-b770-b6605608f831@avs.org
DTSTAMP:20260410T165947Z
DTSTART:20220929T140000Z
DTEND:20220930T210000Z
LOCATION: Online/Virtual
DESCRIPTION:\nCourse ObjectivesKnow the basic concepts of plasma etching.Understand the physics of RF glow discharges (both high and low density).Understand the surface science aspects of reactive ion etching (RIE).Learn about plasma-surface chemistry leading to etching.Recognize the factors that influence etching anisotropy.\n\n Online/Virtual\n\n Heather Korff
SUMMARY: AVS National Online Short Course: Plasma Etching and RIE: Fundamentals & Applications (1 or 2 day option: Day 1- Fundamentals; Day 2- Applications)
PRIORITY:3
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DESCRIPTION:Reminder
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