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UID:ccdfaeda-7f1f-40c3-b6fa-2e2e701788b1@avs.org
DTSTAMP:20260429T183934Z
DTSTART:20220928T170000Z
DTEND:20220928T180000Z
LOCATION: Virtual/Online
DESCRIPTION:\nThe semiconductor industry is headed towards heterogeneous integration in 2.5D or 3D form being driven primarily by the high cost of monolithic integration, extended time to market using advanced process nodes on large designs, and heterogeneity of systems. This is great news for packaging.\n\nOn the communication side emerging 5G mmWave frequencies are projected to support enormous bandwidth with 1-10Gps data speeds. Active research is ongoing to increase the data speeds even more by moving to higher frequencies in the sub-THz frequency range namely, 6G. With a broad range of frequencies to support, advanced packaging solutions are required.\n\nThis presentation addresses the needs for 5G and 6G communication along with the progress made on glass interposer-based solutions at Georgia Tech’s Packaging Research Center, which includes work being done in collaboration with Sandia. Advances in the application of machine learning for design optimization in the context of beamforming will be discussed as well.\n\n Virtual/Online\n\n Heather Korff
SUMMARY: AVS e-Talk: Heterogeneous Integration for mmWave Wireless Communication Systems
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