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UID:b905dacc-00cb-4b67-bab4-5796de3e67e9@avs.org
DTSTAMP:20260429T184206Z
DTSTART:20220210T150000Z
DTEND:20220210T220000Z
LOCATION: Virtual/Online
DESCRIPTION:\nThis course starts with a brief review of the basics of processing plasmas. This knowledge is then applied to the plasma deposition of thin films in practical device applications. The unique aspects of PECVD are emphasized by an in-depth comparison of PECVD with other deposition technologies. The relationship between process parameters and film properties is illustrated by reviewing several important device applications of PECVD.\n\nThe deposition and properties of important materials such as silicon oxide, silicon nitride, silicon carbide, amorphous and polycrystalline silicon, diamond and diamond-like carbon are discussed in detail.\n\nMuch emphasis is placed on an up-to-date discussion of hardware and hardware considerations as these apply to process control and process safety.\n\nImportant trends in the design and operation of commercial equipment, particularly as it relates to microelectronics, are discussed in detail.\n\n Virtual/Online\n\n Heather Korff
SUMMARY: Plasma-Enhanced CVD: Fundamentals, Techniques and Applications (1 day)
PRIORITY:3
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DESCRIPTION:Reminder
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