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UID:da960209-caea-4f21-baa3-e1b6c3735cee@avs.org
DTSTAMP:20260429T184103Z
DTSTART:20210916T140000Z
DTEND:20210916T210000Z
LOCATION: Online/Virtual
DESCRIPTION:\nCourse ObjectivesKnow the basic concepts of plasma etching.Understand the physics of RF glow discharges (both high and low density).Understand the surface science aspects of reactive ion etching (RIE).Learn about plasma-surface chemistry leading to etching.Recognize the factors that influence etching anisotropy.\n\n Online/Virtual\n\n Heather Korff
SUMMARY: AVS National Online Short Course: Plasma Etching and RIE: Fundamentals and Applications <b>(Day 2 –  9/16)</b>
PRIORITY:3
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TRIGGER:P0DT0H15M
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DESCRIPTION:Reminder
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