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UID:bc459c2c-fc12-4e7e-ac9d-956037de5019@avs.org
DTSTAMP:20260429T184025Z
DTSTART:20210914T140000Z
DTEND:20210914T210000Z
LOCATION: Online/Virtual
DESCRIPTION:\nCourse ObjectivesKnow the basic concepts of plasma etching.Understand the physics of RF glow discharges (both high and low density).Understand the surface science aspects of reactive ion etching (RIE).Learn about plasma-surface chemistry leading to etching.Recognize the factors that influence etching anisotropy.\n\n Online/Virtual\n\n Heather Korff
SUMMARY: AVS National Online Short Course: Plasma Etching and RIE: Fundamentals and Applications <b>(Day 1 –  9/14)</b>
PRIORITY:3
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DESCRIPTION:Reminder
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