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UID:995e4866-87a9-4d59-b19f-387ddf4eaf50@avs.org
DTSTAMP:20260308T034516Z
DTSTART:20210223T150000Z
DTEND:20210223T220000Z
LOCATION: Virtual/Online
DESCRIPTION:\nThis one day version of the course will covers plasma-assisted etching phenomena and equipment in a manner that will assist the attendee in understanding and developing plasma etching and RIE processes. The emphasis will be on the fundamental physical and chemical processes that determine the consequences of a reactive gas plasma/surface interaction. The role of energetic ions as encountered in RIE systems and the factors that influence anisotropy of etching will be described. Many kinds of plasma-assisted etching equipment will be discussed, including capacitively coupled, inductively coupled, and wave-generated plasma sources.\n\nIn addition there will be discussion on the applied aspects of plasma-assisted etching. Emphasis will be on mechanistic understanding as opposed to specific processing issues, recipes, and problems.\n\nREGISTER HERE!\n\n Virtual/Online\n\n Heather Korff
SUMMARY: AVS Online Short Course: Plasma Etching and RIE
PRIORITY:3
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DESCRIPTION:Reminder
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