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DTSTAMP:20260429T184237Z
DTSTART:20210210T180000Z
DTEND:20210210T220000Z
LOCATION: Virtual/Online
DESCRIPTION:\nDate: Wednesday, February 10, 2021\nTime: 1:00 p.m.-5:00 p.m. EST\n\nAtomic Layer Deposition (ALD) has become a key technology in both the lab and the fab with many devices and other applications benefiting from the (ultra)thin films that can be prepared with very precise thickness control and with unparalleled conformality and uniformity. Nowadays, a significant number of the ALD processes employed are so-called plasma-assisted or plasma-enhanced ALD processes. In the last decade, this method has faced a real breakthrough in high-volume manufacturing and an extensive set of processes and reactor designs have been demonstrated. Yet the reasons why and when to use plasma-assisted ALD are often not clear as well what kind of plasma configurations to use and which conditions to apply. Also, misconceptions about the implications of using plasmas during ALD exist, for example with respect to plasma damage and limitations of conformality. This webinar will address these aspects starting with the basics of ALD and plasma-based processing and will range up to the applications that can benefit from plasma-assisted ALD.\n\nREGISTER HERE!\n\n Virtual/Online\n\n Heather Korff
SUMMARY: AVS Webinar: Plasma-Assisted Atomic Layer Deposition: From Basics to Applications
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