Call for Abstracts - Divisions & Groups


Advanced Surface Engineering (SE)

The program of the Advanced Surface Engineering Division (SE) focuses on all topics related to engineering the properties and functionalities of surfaces of all kinds. Both fundamental scientific and application-oriented contributions presenting experimental and/or theoretical and computational results are welcome. The session “Plasma-assisted Surface Modification and Deposition Processes” invites contributions aimed at understanding or further developing techniques and processes to alter the appearance of surfaces or to synthesise thin films and coatings on surfaces of interest. Topics related to analysis and characterisation of such modified surfaces and new and advanced characterisation techniques will be covered by the session “Nanostructured Thin Films and Coatings”. A frequent application of coatings is to protect the underlying surface from environmental influences. The session “Protective Coatings for Tribological Applications” will deal with tribological surfaces and coatings of interest in academia and in industrial and ‘real-world’ applications. Finally, the session “New Challenges and Opportunities in Surface Engineering” will serve as a forum to gather new ideas and developments in the field. The main focus will be on topics and contributions that show how surface engineering can assist to solve present-day and future problems. Invited lectures will review and highlight the state-of-the-art and latest findings in various topics. Academic, industry and national laboratory scientists, technicians and especially junior researchers and PhD students from various disciplines and all countries are invited to contribute to our technical program, part of the AVS 64, and benefit from meeting/making friends and colleagues in sunny Tampa, Florida, in 2017.

SE1+PS+SS  Plasma-assisted Surface Modification and Deposition Processes
  • Daniel Lundin, Université Paris-Sud, France, "Key Features of Reactive High Power Impulse Magnetron Sputtering"
SE2+2D+NS+SS+TF  Nanostructured Thin Films and Coatings
  • Johanna Rosen, Linköping University, Sweden , "Plasma Process Development and Optimized Synthesis of TiB2 Coatings from DC Magnetron Sputtering, High Power Impulse Magnetron Sputtering, and DC Vacuum Arc"
SE3+MN  Protective Coatings for Tribological Applications
  • Samir Aouadi, University of North Texas, "Adaptive Ceramic Coatings for Extreme Environments"
SE4+BI+SS  New Challenges and Opportunities in Surface Engineering
  • Paul K. Chu, City University of Hong Kong, Hong Kong Special Administrative Region of China, "Plasma Surface Engineering of Biomaterials"
SE5  Advanced Surface Engineering Poster Session

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Applied Surface Science (AS)

The Applied Surface Science Division (ASSD) provides a forum for research in the preparation, modification, characterization, and utilization of surfaces in practical applications.  Areas of interest range from nanoscience, polymers, and semiconductor processing to forensic science and biotechnology.  The Division has long been the premier gathering place for the global surface analysis community, with historical concentrations in techniques such as SIMS and XPS/Auger spectroscopies, including presentations representing a mixture of cutting-edge applications and the fundamentals supporting the measurement science.  We also encourage contributions from non-traditional techniques such as Atom Probe Tomography.  The Division is constantly striving to provide a forum for current and mature interests (with sessions such as Quantitative Surface Analysis and Practical Surface Analysis) while identifying key areas for future development.  For AVS-64, we are supporting several focus topics:  Tribology (TR), Spectroscopic Ellipsometry (EL), Advanced Ion Microscopy (HI), Scanning Probe Microscopy (SP), Frontiers of Synchrotron Radiation in Surface and Interface Science (SA), Tandem MS (TM), Actinides and Rare Earths (AC) and 2D Materials (2D).  Several special sessions this year are designed to showcase industrial and novel applications of surface analysis.   

AS1+BI+MI  Practical Surface Analysis:  Getting the Most Out of Your Analysis using Complementary Techniques
  • Tom Wirtz, Luxembourg Institute of Science and Technology (LIST), Luxembourg, "Correlative Microscopy based on Secondary Ion Mass Spectrometry for High-Resolution High-Sensitivity Nano-Analytics"
AS2+BI  Practical Surface Analysis: Complex, Organic and Bio-systems
  • Mary Kraft, University of Illinois at Urbana-Champaign, "High-resolution SIMS Imaging of Subcellular Structures"
AS3+MI+SS  Quantitative Surface Analysis: Effective Quantitation Strategies
  • Rasmus Havelund, National Physical Laboratory, UK, "Quantitative Organic Depth Profiling Using SIMS"
AS4+TF  Problem Solving Using Surface Analysis in the Industrial Laboratory
  • Daniel J. Hook, Bausch and Lomb, " Employing a Surface and Bulk Analytical Approach to the Synthesis and Characterization of Ophthalmic Biomaterials"
  • Vincent Smentkowski, General Electric Global Research Center, "Surface Analysis in the Industrial Laboratory"
AS5+BI+MI+NS+SA+SS  Beyond Traditional Surface Analysis: Pushing the Limits
  • Nina Ogrinc Potocnik, Maastricht University, The Netherlands, "Surface Analysis of Intact Biomolecules: the Bigger They Are the Harder They Fly"
AS6+2D+NS+SA  2D, 3D and nD Imaging of Surfaces, Buried Interfaces and Nanostructures
  • Jean-Paul Barnes, CEA, LETI, MINATEC Campus, "Correlation of Morphological and Hyperspectral Characterization Techniques for Nanoelectronic and Energy Applications"
  • Karen Kruska, Pacific Northwest National Laboratory, "Insights into Corrosion and Radiation Damage Processes Through 2D and 3D Imaging at the Nanoscale"
AS7+BI+SA+SS  Spectroscopy of the Changing Surface
  • Iradwikanari Waluyo, Brookhaven National Laboratory, "In Situ Investigation of the Dynamic Transformations of Model Catalyst Surfaces using Ambient Pressure XPS"
AS8+SS  Advances in Automation and Data Analysis
  • Lev Gelb, University of Texas at Dallas, "Data Analysis in Thin Film Characterization: Learning More With Physical Models"
  • Matthew Linford, Brigham Young University, "Advanced Analysis of XPS and ToF-SIMS Data"
AS9+MS  Unlocking the Sample History: Forensics and Failure Analysis
  • Thomas Beebe, Jr., University of Delaware, "Surface Analysis of Fine Art: from the Renaissance to The Scream"
  • Peng Lu, General Motors, "Application of Surface Analysis in Understanding Li-ion Batteries Degradation"
AS10     Applied Surface Science Poster Session

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Biomaterial Interfaces (BI)

The Biomaterials Interfaces Division is organizing a series of sessions to provide an interdisciplinary forum for the presentation and discussion of fundamental aspects of bio-interface science and engineering. The need to increase our understanding of the interactions between biomolecules and surfaces, the behavior of complex macromolecular systems at materials interfaces, and interactions between biomolecules, is being driven by the rapid growth in biomedical research and the role these applications play in the fields of biology, biotechnology, protective coatings, diagnostics, dentistry and medicine. The BI program brings together recent advances made in materials science and molecular biology with sophisticated surface and interface analysis methods, and theoretical and modeling approaches to biological systems. Areas of interest are: Cells at Surfaces, including cell-material interactions, tissue engineering, cell and tissue characterization at interfaces, regenerative medicine; Control of microbes and fouling, including biofilms, biofouling, attachment and adhesion of microbes, assessment of antifouling and fouling release function, antifouling coatings, motility at interfaces, colonization analysis, biofilms and EPS, Biomolecules at Interfaces, including proteins at surfaces, nucleic acids, polysaccharides, adsorption, blood-contacting materials, bioadhesion, and infection and immunity; Characterisation of Biological and Biomaterials Surfaces, including: spectroscopy, imaging, microscopy, optical and mechanical methods of thin film analysis, characterization in biological media, quantification, chemometrics, microfluidics, time- and spatial resolution, scanning probe techniques; Sensing and Biophysics at Surfaces, including: biological membranes, vesicles, membrane processes, forces, recognition, signaling, biosensors, microfluidics, point-of-care devices, paper based sensors, electrochemistry; Biomaterials and Nanomaterials fabrication, including including organic thin films, polymer coatings, hybrid coatings, biologically inspired materials, plasma produced biomaterials, patterning, nanofabrication; Bio from 2D to 3D : Challenges in Fabrication and Characterization, including rapid prototyping, additive manufacturing, 3D structures, tissue formation, implant integration, artificial organs, 3D biofilm structures, 3D Characterization techniques, 3D chemical analysis, 3D tomographic analysis, microscopy, 3D tracking. Special session In honor of Dave Castner's 65th Birthday: Multitechnique Bio-Surface Characterization, with submissions to celebrate Dave Castner’s contributions to the AVS. The BI program begins with the traditional Sunday afternoon Plenary Session. We also invite submissions of Flash/Poster Presentations, to be made in a dedicated session with an accompanying Networking Session involving associated poster presentations. Joint BID/Biointerphases prizes will be awarded for the best student Flash/Poster presentations.

BI1  Cells at Surfaces
  • Carsten Werner, Leibniz-Institut für Polymerforschung, Dresden, Germany
BI2  Engineering a Paradigm Shift in Control of Microbes and Fouling
  • Gabriel Lopez, University of New Mexico
BI3+AS  Biomolecules at Interfaces
  • Markita Landry, University of California at Berkeley, “Synthetic Infrared Nanosensors for Brain Imaging of Modulatory Neurotransmitters”
BI4+AS+SA  Characterisation of Biological and Biomaterial Surfaces
  • Jonathan Counsell, Kratos Analytical Limited, UK, “XPS – A Surface Analysis Tool for Biomaterial Characterisation”
BI5+AS+MN  Sensing, and Biophysics at Surfaces
  • Norma Alcantar, University of South Florida
BI6+NS  Biomaterials and Nanomaterials Fabrication
  • Ellen Fisher, Colorado State University, “Unraveling the Complexity of Plasmas, Nanomaterials and Biomaterials: From Nanoparticles to Tunable Porous 3D Networks”
BI7+AS+MI+SA  Bio from 2D to 3D: Challenges in Fabrication and Characterization
  • Thomas Boland, The University of Texas at El Paso
BI8+AS  In Honor of Dave Castner's 65th Birthday: Multitechnique Bio-Surface Characterization
  • Buddy Ratner, University of Washington, “Contributions Advancing Surface Technologies: NEXAFS, ESCA, Rhodium (and More)”
  • Matt Wagner, Proctor and Gamble, “A Physical Chemist and a Chemical Engineer Walk Into a Bar…Reflections on Surface & Interface Science”
BI9  Biomaterial Interfaces Poster Session with Flash presentations

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Electronic Materials & Photonics (EM)

The Electronic Materials and Photonics Division (EMPD) encompasses the science and engineering of materials, interfaces, and processing that advance electronic and/or photonic device technologies. AVS 64 will include sessions on emerging topics such as quantum information, valleytronic devices, and ultrawide band gap materials, in addition to core topics such as computing beyond Moore's Law, integrated photonics and electronics, charge transport in disordered materials, nanophotonics, radiation hardening, and more. EMPD consistently attracts distinguished invited speakers from around the globe. We will host over 15 invited speakers this year including: Tony Heinz (Stanford University), Teri Odom (Northwestern University), David Awschalom (University of Chicago), Efrat Lifschitz (Technion), Arka Majumdar (University of Washington), and Masataka Higashiwaki (National Institute of Information and Communications Technology), and Nerissa Draeger (Lam Research). A new poster competition will be held at AVS 64 with winning presenters receiving a $500 cash prize. As in prior years, postdoc travel awards will be available. The EMPD industrial forum will also return and provide an intimate opportunity for students to meet with company representatives.

EM1 Novel Materials and Devices for Low Power and High Performance Electronics Platforms
  • Robert M. Wallace, The University of Texas at Dallas, "Emerging Materials for Advanced Devices: Integration Challenges and Opportunities"
EM2+2D+MI  Materials and Devices for Valleytronic Applications
  • Tony Heinz, Stanford University, "Optical Control of the Valley Degree of Freedom in Transition Metal Dichalcogenides"
  • George (Yu-Shu) Wu, National Tsing Hua University, Taiwan, "VOI-based Valleytronics in Graphene"
EM3+MI+TF  Growth, Electronic, and Magnetic Properties of Heusler Compounds
  • Johnpierre Paglione, University of Maryland, "Topology, Magnetism, and Superconductivity in Ternary Half-Heusler Semimetals"
EM4 Integrated Photonics and Electronics
  • Matt King, Northrop Grumman, "Development of Chalcogenide Phase Change Materials for RF Switch Applications"
  • Arka Majumdar, University of Washington, "Dielectric Free Form Metasurfaces for Optical Sensing"
EM5+MN  Materials for Quantum Information
  • David Awschalom, University of Chicago, "Creating Quantum Technologies with Spins in Semiconductors"
  • Adam Gali, Hungarian Academy of Sciences, "Point Defects in Solids for Quantum Technology: Ab initio Simulations and Realization"
EM6 Charge Transport in Disordered Solids
  • David Drabold, Ohio University, "Electrons and Phonons in Amorphous Semiconductors"
EM7+MI+NS+SP+SS  Nanoscale Imaging of Electronic and Photonic Nanostructures and Surfaces
  • Teri Odom, Northwestern University, "Evolutionary Design of Multi-functional Optical Metasurfaces"
EM8+NS  Nanostructures for Electronic and Photonic Devices
  • Efrat Lifshitz, Technion – Israel Institute of Technology, Israel, "Spin Properties in Colloidal Quantum Dots"
  • Dimitris Tsoukalas, National Technical University of Athens, Greece, "Integration of Metallic Nanoparticles in Sensing and Memory Devices for Resistance Modulation and Enhanced Switching"
EM9+NS  Wide and Ultra-wide Band Gap Materials for Electronic Devices: Growth, Modeling, and Properties
  • Ramón Collazo, North Carolina State University, "A Thermodynamic Supersaturation model for the Growth of AlGaN by MOCVD"
  • Masataka Higashiwaki, National Institute of Information and Communications Technology, Japan , "Ultra-wide-bandgap Ga2O3 Material and Electronic Device Technologies"
EM10    Radiation Hardened Electronics and Detection
  • Vincent Woods, Pacific Northwest National Laboratory, "Nitride Based Avalanche Photodiode Detector Structures for Nuclear Detection Applications"
EM11+SS  Surface and Interface Challenges in Semiconductor Materials and Devices
  • Nerrisa Draeger, Lam Research Corporation, "Selective Passivation of SiGe and Ge Surfaces for Advanced Device Fabrication"
EM12    Electronic Materials and Photonics Poster Session

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Magnetic Interfaces & Nanostructures (MI)

Magnetic Interfaces and Nanostructures Division (MI) program features pioneering, controversial, introductory and emerging results in topical areas related to magnetic interfaces and nanostructures. Particular attention will be given to research areas in magnetism that are of strong interest to the AVS community so that maximum overlap with other divisions and focus topics can be achieved. The 2017 MI program topics include: (1) Novel Magnetic Order at Interfaces; (2) Spin Orbit Phenomena at Surfaces and Interfaces; (3) Role of Chirality in Spin Transport and Magnetism; (4) Controlling Magnetism in Oxides and Multiferroics. The list of invited speakers  features senior as well as early career scientists from Europe, Asia, the Middle East and the United States with diverse backgrounds. The Magnetic Interfaces and Nanostructures Division offers the Leo Falicov Award to the best graduate student presentation. MI offers a postdoctoral fellow award for the best presented paper at this year’s International Symposium.

MI1+2D+AC+SA+SS  Novel Magnetic Order at Interfaces
  • Hyonsoo Yang, NUS, Singapore, "Chiral and Proximity Induced Magnetism in 2D/Ferromagnetic Heterostructures"
  • Jiabao Yi, The University of New South Wales, Australia, "New Magnetic Materials"
MI2+2D+AC+NS  Spin-Orbit Phenomena at Surfaces and Interfaces
  • Philip King, University of St. Andrews, UK, United Kingdom of Great Britain and Northern Ireland, "Spin-split States on Oxide Surfaces"
  • Kenta Kuroda, The University of Tokyo, Japan, "Coherent Control over Spin-polarized Dirac Surface State in Topological Insulators"
MI3+BI+EM+SA  Role of Chirality in Spin Transport and Magnetism
  • Karen Michaeli, Weizmann Institute, Israel, "Role of Chirality in Spin Transport and Magnetism"
  • Yossi Paltiel, The Hebrew University, Israel, "Experimental Realization of CISS Devices using Optical or Electrical Excitation"
MI4+SA  Controlling Magnetism in Oxides and Multiferroics
  • Nian Sun, Northeastern University, "Integrated Magnetoelectric Materials for Sensing, Power, RF and Microwave Electronics"
  • Carlos Vaz, Paul Scherrer Institut, Switzerland, "Intrinsic Interfacial Phenomena and Spin Structure in Nano and Heterostructures"
MI5   Magnetic Interfaces and Nanostructures Poster Session

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The MEMS and NEMS Technology Group (MN) program will highlight recent advances in the broad areas of micro/nanoelectromechanical systems (MEMS/NEMS). It will feature the latest studies of novel materials, processes, devices, and emerging functions and applications of MEMS/NEMS, in various areas including manufacturing, energy, communication, and healthcare. The ability to manipulate and engineer mechanical structures in various emerging low-dimensional materials creates intriguing possibilities of integrating these devices with existing fluidic, electronic and optical on-chip networks. This year's sessions will cover such areas that are thematically related to multiscale phenomena, emerging materials, technologies, and advanced manufacturing for new devices and systems that interact with real world or promise for critical applications, along with advanced fabrication, characterization, integration and packaging of MEMS/NEMS. The program continues to embrace the latest progress in optical MEMS/NEMS, micro/nanophotonics, optomechanics, quantum MEMS/NEMS, resonant systems, CMOS-MEMS, mesoscopic dynamics and dissipation processes, inertial sensors, chemical sensors and lab-on-chip analytical microsystems, harsh-environment transducers, parametric and nonlinear MEMS/NEMS, and MEMS/NEMS-enabled energy technologies, etc. It also aims to capture some of the latest advances in soft materials, flexible and implantable MEMS/NEMS for biosensing, bio-inspired microsystems, wearable and wireless healthcare. The AVS64 MN program includes a feature session on the frontier of large scale integration and nanosensors, from gas sensing to mass spectrometry.

 MN1+NS  Multiscale Phenomena and Manufacturing in Micro- and Nano- Systems
  • Igor Bargatin, University of Pennsylvania, “Plate Mechanical Metamaterials: The Thinnest Objects You Can Pick Up by Hand”
  • Matteo Rinaldi, Northeastern University
MN2+EM+NS  Optomechanics, Photonics, and Quantum Nanosystems
  • Mo Li, University of Minnesota, "GHz Integrated Acousto-Optics"
  • Kartik Srinivasan, NIST, "Coupling Piezoelectric MEMS to Cavity Optomechanics"
MN3+BI+SS+TR  Surfaces and Interfaces in Micro- and Nano-Systems
  • Sudipta Seal, University of Central Florida, “Role of Surfaces in Assembly of Ceria Nanostructures”
  • Jack Judy, University of Florida, Gainesville
MN5+EM  Energy and MEMS: Heating/Cooling/Calorimetry, Harvesting/Storage, Power/Dissipation
  • Chris Keimel, General Electric Global Research Center
  • Dana Weinstein, Purdue University, “Electron-Phonon Waltz: Acoustoelectrics in MEMS”
MN6+NS  Large Scale Integration of Nanosensors
  • Sebastien Héntz, CEA, LETI, MINATEC Campus, France, “Large Scale Integration: A Not-so-simple Cure for Loneliness of Silicon Nanoresonators”
  • Peter Hesketh, Georgia Institute of Technology, “Magnetically Actuated Synthetic Cilia for Microfluidics”
  • Genki Yoshikawa, National Institute for Materials Science (NIMS), Japan, “Nanomechanical Sensors (MSS, AMA) toward IoT Olfactory Sensor Systems”
  • Ted Zellers, University of Michigan

MN8+TR  Tribology and MEMS/NEMS

MN9 MEMS/NEMS Poster Session

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Manufacturing Science & Technology (MS)

MSTG sessions present research topics related to the science and technology of manufacturing. This year we focus on challenges in additive manufacturing, advanced characterization and metrology challenges for IC manufacturing, and sustainable manufacturing. Our session on working with government labs and user facilities enables representatives  of these labs and user facilities to present the capabilities of their organizations and how the AVS attendees can work with them.

MS1+AS  Advanced Surface, Interface, and Structural Characterization for High Volume Manufacturing
  • Steven Consiglio, TEL Technology Center, America, LLC, "Development of Ultra-thin ALD Grown high-k Dielectrics and Interconnect Diffusion Barrier Layers aided by Advanced X-ray Structural Analysis for sub 10nm Nodes"
  • Jean Jordan-Sweet, IBM Research Division, T.J. Watson Research Center, "Impact of Synchrotron XRD Techniques on Microelectronics Manufacturing Technologies"
  • Auther Woll, Cornell Laboratory for Accelerator-Based Sciences and Education, "The Cornell High Energy Synchrotron Source Upgrade: Current and Future Capabilities for Thin-film Research"
MS2+SU  Surface and Interface Characterization for Manufacturing of Devices on Textiles and Paper

MS3Additive Manufacturing of High Temperature Materials
  • Jean-Pierre Kruth, Kuleuven, Belgium
  • Tassilo Mortiz, Fraunhofer Institute for Ceramic Technologies and Systems, Germany
  • Holly Shulman, Ceralink
MS4Surface Science and Multi Material Additive Manufacturing
  • Arvind Agarwal, Florida International University, “Thermal Spray for Additive Manufacturing”
  • Wojciech Matusik, MIT
MS5 Working with Government Labs and User Facilities

MS6 Topics in Manufacturing Science and Technology

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Nanometer-scale Science & Technology (NS)

The Nanometer-scale Science and Technology Division (NSTD) at AVS explores the science and technology that emerges when material is shrunk to the nanoscale. Nanoscience and Nanotechnology have become pervasive throughout the scientific community as can be attested by the multiple sessions addressing their different aspects at the AVS Symposium. At the NSTD sessions researchers from around the globe will present their work on topics such as nanoscale devices and quantum systems, exploiting nanomaterials for applications in photonics, plasmonics, catalysis, surface chemistry, sensors, biomechanics, imaging, and energy, including nanoscale characterization and spectroscopy. This year, the program will highlight the following:  (a) Novel approaches for the nanoscale imaging and characterization of materials;  (b) Deposition and use of oxide- and diamond-based nanomaterials; (c) Novel approaches for the fabrication at the nanoscale; and (d) Convergence of nanotechnology with photonics, mechanics, magnetism and electronics. Finally, the program will include a special session on the applications of nanotechnology to renewable energies.

NS1+AS+EM+MI+SP+SS  Nanoscale Imaging and Characterization
  • Renu Sharma, National Institute of Standards and Technology, "Hybrid Transmission Electron Microscope: an Integrated Platform for in Situ Imaging and Spectroscopies"
NS2+SP+SS  Advances in Scanning Probe Microscopy
  • Roger Proksch, Asylum Research, an Oxford Instruments Company, "Speed, Resolution and Nanomechanics: the Fourth Decade of Ambient and Liquid AFM Begins"
NS3 Microwave & Terahertz Spectroscopy of Nanomaterials
  • Jeremy Levy, University of Pittsburgh, "Oxide Nanoelectronics on Demand"
NS4+HC+SS  Oxides in Nanotechnology
  • Ulrike Diebold, Technical University of Vienna, Vienna, "Metal Oxide Surfaces: Structure, Adsorption, Growth"
NS5+MN  Nanodiamonds: Thin Films and Applications

NS6+MN+MS+SS  Nanopatterning, Nanofabrication and 3D Nanomanufacturing
  • Andrew Lupini, Oak Ridge National Laboratory, "Positioning and Manipulating Single Dopant Atoms Inside Silicon"
NS7+EM+MN+PS+SS  Nanophotonics and Plasmonics
  • Naomi Halas, Rice University, "Towards Active and Sustainable Plasmonics"
NS8+MN  Nanomechanics
  • Vladimir Aksyuk, National Institute of Standards and Technology, Center for Nanoscale Science and Technology, "Cavity Optomechanical Coupling in Chip-Scale Plasmonic and Photonic Transducers for Nanoscale Measurements and Optical Signal Control"
NS9+EM+MI  Nanomagnetism and Spintronics
  • Roland Wiesendanger, University of Hamburg, Germany, "The Exciting Physics of Spin Chains Coupled to a Metallic Substrate"
NS10+EM+SS  Atomic Scale Electronics
  • Michelle Simmons, University of New South Wales, Australia
NS11+SS+SU  Nanotechnology for Renewable Energy
  • David Cahen, Weizmann Institute of Science, Israel, "Halide Perovskites, How Special Are They?"
  • Mark Hersam, Northwestern University, "NSTD-Recognition Award Talk: Mixed-Dimensional Nanomaterial Heterostructures for Electronic and Energy Applications"
NS12+EM  Nanometrology in Nanoelectronics
  • Alain C. Diebold, SUNY College of Nanoscale Science and Engineering, "Nanometrology and Nanocharacterization in Nanoelectronics"
NS13     Nanometer Scale Science and Technology Poster Session

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Plasma Science & Technology (PS)

The 2017 Plasma Science and Technology Division (PSTD) Program highlights state-of-the-art advances in plasma research, ranging from fundamental studies of plasma physics and chemistry to applications for semiconductor fabrication, 2D materials and nanomaterials enablement, and plasmas for energy applications.  The core program includes thirteen oral sessions and a poster session, as well as additional joint sessions with the “Applied Surface Science”, “Electronic Materials” and “Thin Films” divisions as well as “2D” and “Plasmas Processing for Biomedical Applications” focus topics.  A special highlight for 2017 is a session to Commemorate the Life and Career of Harold Winters.

PS1  Advanced BEOL/Interconnect Etching
  • Hiromasa Mochiki, Tokyo Electron, "Grand Challenges and Evolution in Etch"
PS2  Advanced FEOL/Gate Etching
  • Nobuyuki Kuboi, Sony Corporation, Japan, "Prediction and Control of Fluctuation of Etching Properties by Simulation Technology"
PS3+NS  Advanced Patterning
  • Ying Zhang, Applied Materials, "Patterning Challenges and Perspective Solutions for 5nm and Beyond"
PS4+AS+SE  Atmospheric Pressure Plasmas
  • Selma Mededovic, Clarkson University, "The Role of Bulk Liquid Transport Processes in the Chemistry of a Plasma-Liquid Interface"
  • Fred Roozeboom, Holst Centre / TNO, Netherlands, "Atmospheric Plasma-Enhanced Spatial ALD of Oxides"
PS5+NS+SS+TF  Atomic Layer Etching I
  • Thorsten Lill, Lam Research Corporation, "Atomic Layer Etching: Fundamentals and Applications"
  • Wataru Mizubayashi, AIST, Japan, "Ge Atomic Layer Etching for High Performance FinFET"
PS6+NS+SS+TF  Atomic Layer Etching II
  • Mingmei Wang, TEL Technology Center, America, LLC, "Concurrent Simulation and Experiment to Solve Grand Challenges of Plasma Etch"
PS7+SS  Commemorating the Life and Career of Harold Winters (ALL INVITED SESSION)

PS8  Modeling of Plasmas
  • Andrew Gibson, LPP, CNRS, Ecole Polytechnique, Université Paris-Saclay, France, "Understanding Particle-Surface Interactions and Their Importance in Plasma Processing: a Plasma Modelling Perspective"
  • Satoshi Hamaguchi, Osaka University, Japan, "Science of Plasma-Surface Interaction for Modern Semiconductor Process Technologies"
PS9+SS+TF  Plasma Deposition and Plasma Assisted ALD
  • Hojun Kim, Samsung, "Analysis of Species Distribution during an Amorphous Hydrogenated Silicon Deposition using Intermediate Pressure Capacitively Coupled Plasmas"
PS10+VT  Plasma Diagnostics, Sensors and Control
  • Ed Barnat, Sandia National Laboratory, "Studying Dynamic and Structured Plasma Systems Utilizing Laser-Collision Induced Fluorescence"
  • Shota Nunomura, AIST, Japan, "In-Situ Diagnostics of Processing Plasma and Semiconductor Films for High-Efficiency Silicon Hetero-Junction Solar Cells"
PS11+NS+SS  Plasma Processing for Nanomaterials & Nanoparticles
  • Rebecca Anthony, Michigan State University, "Non-Equilibrium Plasmas for Nanoparticle Synthesis: from Semiconductors to Metals"
  • Kostya Ostrikov, Queensland University of Technology, Australia, "Plasma Catalysis: a Powerful Blend of the Four States of Matter"
PS12+AS  Plasma Processing of Challenging Materials
  • Erwine Pargon, LTM - CEA/LETI, France, "Damage Free Plasma Etching Processes of IIIi-V Semiconductors for Microelectronic and Photonic Applications"
  • Masaharu Shiratani, Kyushu University, Japan, "Spatiotemporal Fluctuation of Cvd Plasmas and Film Qualities"
PS13     Plasma Sources
  • Aranka Derzsi, Wigner RCP, Hungary, "Electron Heating Dynamics in Capacitively Coupled Electronegative Plasmas"
  • Osamu Sakai, Kyoto University, Japan, "High-Density Plasma Generation in Low-Pressure Metamaterial Space"
PS14+AS+SS  Plasma Surface Interactions
  • Olivier Guaitella, Ecole Polytechnique, France, "Molecule Formation on Dielectric Surfaces under Glow and Dielectric Barrier Discharges"
PS15+PB  Plasmas for Biomedical Applications

PS16     Plasma Science and Technology Poster Session

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Surface Science (SS)

The Surface Science Division provides a forum for cutting-edge and foundational research that involves solid surfaces and interfaces. Phenomena that take place at the gas-solid and liquid-solid interfaces are prominent within the SS division programs. Technical sessions address atomistic, structural, electronic, and chemical phenomena at surfaces and interfaces, their impact on materials properties, and their implication for technological and environmental processes. Surface chemistry is an important divisional theme, encompassing the kinetics and dynamics of surface processes and chemical events from adsorption and reaction to catalysis. Film and nanostructure growth is another key theme, explored from a fundamental perspective, through the development of new growth and processing methods for materials preparation. Surface chemical modification and photon-driven chemistry at surfaces are important concentrations. Lively sessions are devoted to the surface science of metallic, semiconductor, oxide, and organic surfaces that support unique chemical activity and electronic properties. Surface science applications in high-impact areas, including energy science, microelectronics, nanotechnology, and environmental science, - are highlighted in the program. This Division's overarching goal is to provide the atomistic insights on solid surfaces and interfaces needed to advance our understanding of materials systems and benefit society.

SS1+NS  Molecular Machines
  • Saw-Wai Hla, Ohio University, “Quantum Molecular Machines”
SS2+HC  Theory and Modeling of Surfaces
  • Angelos Michaelides, University College London, UK, United Kingdom of Great Britain and Northern Ireland, "Towards a Molecular Level Understanding of the Structure and Dynamics of Water at Interfaces"
SS3+HC  Dynamical Processes at Surfaces
  • Gil Alexandrowicz, Technion – Israel Institute of Technology, Israel, "A New Approach for Controlling the Rotational Orientation of a Molecule and Studying the Stereodynamics of a Molecule-Surface Collision"
SS4+EM+HC+MI  Oxides/Chalcogenides: Structures and Reactions
  • Jason Weaver, University of Florida, Gainesville, "Surface Chemistry of Late Transition-Metal Oxides"
SS5+AS+EM  Semiconductor Surfaces
  • Vincent LaBella, SUNY Polytechnic Institute, "Nanoscale Schotky Barrier Visualization"
SS6+AS  Surface Science in the Environment
  • Barbara Finlayson-Pitts, University of California, Irvine
SS7  Photochemistry and Photoelectrocatalysis
  • Greg Kimmel, Pacific Northwest National Laboratory, "Photochemistry of Organics on TiO2(110)"
SS8+AS+MI  Organic/Inorganic Surfaces and Interfaces
  • Erin Iski, University of Tulsa, "The Use of EC-STM to Study the Nanoscale Structure and Behavior of Atomically Thin Ag Films on Au Surfaces"
SS9  Deposition and Growth at Surfaces
  • Michael Tringides, Iowa State University, "Metal Growth on and under Graphene: Morphology, Intercalation and Magnetization"
SS10+HC  Functional Surfaces by Design
  • Michael Trenary, University of Illinois at Chicago, "Infrared Studies of Reactions Over Single-Atom Alloy Surfaces"
SS11+HC  Mechanisms of Surface Chemical Reactions
  • Suzi Jarvis, University College Dublin, Ireland
SS12+HC  New Insights into Metal and Alloy Properties, Chemistry, and Catalysis
  • Stephanie Wettstein, Montana State University
SS13      Surface Science Poster Session

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Thin Films (TF)

The Thin Film Division offers several core oral sessions and one poster session. A broad range of outstanding invited speakers will touch on topics across the breadth of thin film science, technology and applications. There are several sessions dedicated to atomic layer deposition (ALD), encompassing energy conversion and storage, microelectronics, emerging applications, nanostructures, precursors, surface reactions and new innovations in processing. These sessions highlight basic science and the pursuit of applications.  We are excited about the core sessions on Thin Films: growth and characterization, self assembled and layer-by-layer growth. We offer thin film application inspired sessions on sessions on magnetic thin films, synchrotron radiation, and photovoltaics. We are also excited to offer new sessions based on thin film processes for 3D and extreme geometries and exploring industrial needs of thin films aligned with new vision of materials development in AVS.  We offer students the possibility to give a 2-3 minute talk to introduce their posters at the end of the oral sessions.  For the 5th year, we will host a student-only session to highlight the Harper Award candidates in which the student finalists will present their work in an interactive “TED Talk” type of Forum.  This is an excellent opportunity for graduate and undergraduate students in the Thin Film area to get together informally for discussions and to provide feedback for the Harper Award presentations of their fellow students. The Thin Film Division is also pleased to solicit nominations for the Distinguished Technologist Award, which serves to recognize individuals who have provided exceptional technical support of thin film research or related development activities.

TF1+EM ALD for Energy Conversion, Storage, and Electrochemical Processes
  • Julien Bachmann, University of Erlagen, Germany, "Systematic Investigation of Geometric Effects in Porous Electrodes for Energy Conversion Reactions"
TF2+EM+MI  Thin Films for Microelectronics
  • Jin-Seong Park, Hanyang University, Korea, "Atomic Layer Deposition of Oxide Semiconductor for Flexible Electronics"
TF3 ALD Precursors and Surface Reactions
  • Anjana Devi, Ruhr Universitat-Bochum, Germany, "ALD Precursors"
TF4 Advanced CVD and ALD Processing, ALD Manufacturing and Spatial-ALD
  • Jaques Kools, Encapsulix, "High Speed ALD of Multifunctional ALD Ultrabarriers for Flexible OLED Encapsulation"
TF5+MI+NS  ALD and Nanostructures
  • Riikka Puurunen, Aalto University, Finland, VTT Technical Research Centre of Finland, Finland, "Recent Developments in the Analysis of ALD/CVD Thin Film Conformality"
TF6 Emerging Applications for ALD
  • Christos Takoudis, University of Illinois-Chicago, "ALD-based Functionalization of Biomaterials: Recent Developments and Future Challenges"
TF7 Thin Film Photovoltaics
  • Mohammad Khaja Nazeeruddin, Ecole Polytechnique Fédérale de Lausanne (EPFL), “Stable Perovskite Solar Cells by 2D/3D Interface Engineering”
TF8+SE  Control and Modeling of Thin Film Growth and Characterization
  • Yiping Zhao, University of Georgia, "Combining Dynamic Shadowing Growth and Colloidal Monolayer to Design Plasmonic Metamaterials"
TF9 Self-assembled Monolayers and Organic/inorganic Interface Engineering
  • Andreas Fery, Leibniz-Institut für Polymerforschung Dresden, Germany, "Responsive and Interactive Polymeric Coatings" 
TF10    Area-selective Deposition and Sequential Infiltration Synthesis Growth
  • Tony Maindron, CEA, France, "Thin-film Encapsulation for OLED-based (Micro)displays"
TF11+MI   Thin Films for Magnetic and Optical Applications
  • Adam Hauser, University of Alabama, "Paths to Low Spin Damping in Intermetallic Thin Films"
TF12+SA  Thin Films for Synchrotron & Magnetism Applications
  • Jolien Dendooven, Ghent  University, Belgium, “In-situ Synchrotron-based Characterization of Noble Metal ALD Processes”
TF13     Processes for 3D and Extreme Geometries
  • John Abelson, University of Illinois at Urbana Champaign, "Coating and Infilling 3D Geometries by Low-T CVD: HfB2 throughout 0.5 mm Thick CNT Forests"
TF14     Industry Needs/research Opportunities in Thin Film Technology
  • Mahendra Pakala, Applied Materials, “Physical Vapor Deposition of Emerging Resistive Memories”
TF15     Thin Films Poster Session

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Vacuum Technology (VT)

The Vacuum Technology Division (VTD) provides a forum for research in achieving, maintaining, measuring, and analyzing vacuum across a wide range of pressures and applications.  The 2017 VT oral program topics include: (1) (Novel Methods of) Vacuum Measurement, Calibration and Primary and Industry Standards, (2) Gas Dynamics, Simulation and Partial Pressure Analysis, (3) Vacuum Pumping and Material Outgassing, (4) Accelerator and Large Vacuum Systems.  Additionally, we present special sessions in Vacuum Technology: History, MEMS in Vacuum Technology, Vacuum in Cryogenic Environments and Transport. The VT Poster session Tuesday evening features the VT Student Poster Competition, with a first place award of up to $500, where students of any discipline are invited to share their innovative solutions to vacuum equipment challenges. Student presenter awards will also be given for the best presentations.  To be eligible for a student prize, the presenter must be registered as a student and present the work in a VT poster or oral session.
VT1 New Methods of Vacuum Measurement
  • Ove Axner, Umeå University, Sweden, "Fast-Switching Dual Fabry-Perot Cavity-based Optical Refractometry – A Powerful Technique for Drift-Free Assessment of Gas Refractivity and Density"
VT2 Partial Pressure Analysis
  • Kathrin Altwegg, University of Bern, Switzerland, "ROSINA/Rosetta: Exploring the Origin of our Solar System with Mass Spectrometry in Space"
VT3 Material Outgassing and Vacuum Pumping
  • Richard Green, National Research Council, Canada, "Weight of Water on the Solid Surface in Air and Vacuum"
VT4 Gas Dynamics, Modeling, and Simulation
  • Paul Dozoretz, Integrated Process Solutions, MKS Instruments Inc., "A Rigorous Approach to Effluent Gas Management for the Vacuum Processing Industry"
VT5 Leaks, Flows, Outgassing

VT6 Large Vacuum Systems
  • Rai Weiss, Massachusetts Institute of Technology, "Vacuum Technology that Enabled the Detection of Gravitational Waves"
VT7 Surface Science for Accelerators
  • Anne-Laure Lamure, CERN, Switzerland, "Adsorption/Desorption from Amorphous Carbon Coating at Cryogenic Temperatures"
VT8 Extreme High Vacuum
  • Julia Scherschligt, National Institute of Standards and Technology, "Quantum Approach to Extreme High Vacuum Metrology"
VT9 Particle Control, Quality Control, Ultraclean Systems
  • Lutz Lilje, DESY, Germany, "Particle Contamination Control in the Accelerator Vacuum Systems of the European XFEL"
VT10     Transfer, Manipulation and Vacuum Suitcases
  • Urs Maier, Ferrovac GmbH, Switzerland, "UHV- and Cryo-transfer between Independent Analytical Instruments"
VT11+MN  MEMS for Vacuum Technology
  • Wei Yang, PD Sciences LLC, "Silicon-micromachined Turbomolecular Pump"
VT12     Vacuum Desorption
  • Markus Bender, GSI Helmholtzzentrum für Schwerionenforschung GmbH, Germany, "New Aspects on Heavy Ion-Induced Desorption and Their Impact on Next Generation Accelerators"
VT13     History
  • Paul Arnold, Pressure & Vacuum Measurement Solutions,  MKS Instruments, Inc., "Development of an Electrostatic Triode Getter-Ion Pump, 1967-1973"
VT14     The History and Future of Materials, Surfaces and Interfaces (ALL INVITED SESSION)
  • Joe Greene, University of Illinois at Urbana-Champaign, "History of Materials"
VT15     Vacuum Technology Poster (and Student Poster Competition)

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