Roster | Eric Joseph

Eric Joseph

Director (2017-2018)
IBM TJ Watson Research Center
1101 Kitchawan Road, 05-261
Yorktown Heights, NY 10598
Tel: 914-945-2616
E-mail: eric_joseph@avs.org

ERIC A. JOSEPH is a Research Staff Member and Senior Manager of the Unit Process Technology Group within the Science and Solutions organization at the IBM T. J. Watson Research Center in Yorktown Heights, NY.  He received his B.S. and M.S. degrees in physics from the State University of New York at Albany in 1998 and 2000, respectively, and received his Ph.D. in electrical engineering from the University of Texas at Dallas (UTD) in 2005.  His graduate school research in low temperature plasma processing, which earned him a UTD Excellence in Research Fellowship, focused on the role of plasma-surface interactions in dielectric etch applications and included the characterization of advanced porous ULK materials.  He subsequently joined IBM Research focusing on plasma processing for semiconductor applications and developed numerous etch solutions for perovskite, chalcogenide and ferromagnetic materials for non-volatile memory applications such as RRAM, PCRAM and MRAM.  From 2012-2015 he expanded his role within IBM, managing the Advanced Plasma Processing Group, leading etch development efforts for multiple exploratory projects ranging from advanced processes to evaluate aggressive scaling of CMOS devices to prototype nanofluidic devices envisioned to enable low cost DNA sequencing technology.  In addition, he led collaborative efforts with both industry and academia to explore new process capabilities such as novel gas chemistries and atomic layer etching methods.  As of late 2015, his role expanded yet again, to include the entire Unit Process Technology Group, with increasing responsibilities for defining and delivering novel unit process technology strategy and capability for advanced chemical mechanical planarization, electrochemical and wet chemical processes, and thin film deposition and etch processes for IBM's advanced prototyping facility.  He is an author or co-author of over 20 technical papers, has over 80 patents filed or pending, and has been an active member of AVS, serving on the program and/or executive committee of the Plasma Science and Technology Division since 2010.   Recently, he was the PSTD Chair for AVS-62 and was also responsible for establishing the AVS Atomic Layer Etch Workshop, serving as the inaugural Chair of the workshop, held in conjunction with the 2015 ALD Conference.  In addition, he is the incoming Vice Chair for AVS-64 in 2017.